Tccs - Tinned Copper Clad Steel Wire for Electronics Application
Product Details
| Customization: | Available |
|---|---|
| Type: | Bare |
| Conductor Type: | Solid |
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Basic Info.
- Model NO.
- TCCS-RLB
- Application
- Electronics Lead Wire,etc.
- Conductor Material
- Copper Clad Steel
- Material Shape
- Round Wire
- Certification
- ISO9001
- Brand
- Rlb
- Transport Package
- Carton on Pallet
- Origin
- China
- HS Code
- 72299090
- Production Capacity
- 1000 Tons Per Year
Product Description
Tinned copper clad steel is a new type of composite wires. Mainly used in the skeleton, transformer,The quality is excellent.
|
Wire material |
High Purity Copper |
|
Standards |
ASTM B520, SJ/T 2421 |
|
Usage |
Electronic Appliances |
|
Color |
Shining Bright |
|
Conductor Type |
Solid |
|
Service |
OEM & ODM |
|
Life |
More Than 50 Years |
|
Certificate |
ISO9001 |
Application:
It can be used as lead wire and jumper for electronic components or core wire of RF cable. It can also be used for the production of braided wire, which is used for the flexible connection wire of electrical devices,switching appliances and all kinds of shielded network wires and multi-core signal connecting wires.
Advantage:
1. Tinned copper clad steel has excellent solderability.
2. With the change of time, the weldability remains good and can be stored for a long time.
3. The surface is smooth, bright and moist.
4. Stable and reliable performance to ensure high quality and high yield.
Properties of tin plated wire
Standards: ASTM B520, SJ/T 2421
| Nominal Dia | Tolerance | D.C.Resisitance at 20ºC | Conductivity | Breaking Load | Ductility |
| mm | mm | Ω/km | % | N | % |
| 0.1 | ±0.003 | ≤5.5984 | 40 | ≥6.5 | ≥1 |
| 0.12 | ±0.003 | ≤3.8878 | 40 | ≥9.4 | ≥1 |
| 0.16 | ±0.003 | ≤2.1869 | 40 | ≥16.7 | ≥1 |
| 0.203 | ±0.003 | ≤1.3585 | 40 | ≥24.0 | ≥1 |
| 0.24 | ±0.006 | ≤1.0000 | 40 | ≥48.0 | ≥1 |
| 0.65 | ±0.006 | ≤0.13251 | 40 | ≥252 | ≥1 |
| 0.81 | ±0.006 | ≤0.08533 | 40 | ≥391 | ≥1 |
DescriptionNote: this is representative user standard. The thickness of tin layer is about 1 μ M.
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